FMEA and FTA Analyses of the Adhesive Joining Process using Electrically Conductive Adhesives
نویسندگان
چکیده
منابع مشابه
Electrically Conductive Adhesives
Electrically conductive adhesives are being used in electronic packaging for several decades. A brief review of the dynamic development of conductive adhesives under the influence of the miniaturization, the adaptation of environmental friendly manufacturing processes is presented. With respect to the importance of isotropically conductive adhesives (ICA), a new contact model to analyze the pri...
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S ince the advent of through-hole printed wiring boards in the 1950s, surface-mount technology has advanced through chip capacitors and resistors to high-density multilayer hybrids and printed circuit boards. Throughout this 40-year span, solder paste has been the accepted technology for component attach.' The present trend toward fine-pitch resolution ( t0.020") and multilayer constructions of...
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ژورنال
عنوان ژورنال: Acta Polytechnica
سال: 2012
ISSN: 1805-2363,1210-2709
DOI: 10.14311/1530